E1SCA18-14.7456M TR

E1SCA18-14.7456M TR

  • 厂商:

    ECLIPTEK

  • 封装:

    HC49/UP

  • 描述:

    无源晶振 14.7456MHz ±50ppm 18pF 70Ω -40℃~+85℃

  • 数据手册
  • 价格&库存
E1SCA18-14.7456M TR 数据手册
E1SCA18-14.7456M REGULATORY COMPLIANCE (Data Sheet downloaded on Sep 22, 2020) 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Quartz Crystal Resonator HC49/UP Short 2 Pad Surface Mount (SMD) 3.2mm Height Metal Resistance Weld Seal 14.7456MHz ±50ppm at 25°C, ±100ppm over -40°C to +85°C 18pF Parallel Resonant ELECTRICAL SPECIFICATIONS Nominal Frequency 14.7456MHz Frequency Tolerance/Stability ±50ppm at 25°C, ±100ppm over -40°C to +85°C Aging at 25°C ±5ppm/year Maximum Load Capacitance 18pF Parallel Resonant Shunt Capacitance 7pF Maximum Equivalent Series Resistance 70 Ohms Maximum Mode of Operation AT-Cut Fundamental Drive Level 1mWatt Maximum Storage Temperature Range -55°C to +125°C Insulation Resistance 500 Megaohms Minimum (Measured at 100Vdc) ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-202, Method 213, Condition C Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 11/09/2015 | Page 1 of 4 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 E1SCA18-14.7456M MECHANICAL DIMENSIONS (all dimensions in millimeters) LINE MARKING 1 3.20 MAX E14.745M E=Ecliptek Designator 13.30 MAX 0.50 MIN (x2) 4.88 ±0.20 4.85 MAX 0.80 ±0.30 (x2) 11.60 MAX NOTE: Coplanarity 0.360 MAX Suggested Solder Pad Layout All Dimensions in Millimeters 5.5 (X2) 2.0 (X2) 4.0 Solder Land (X2) All Tolerances are ±0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 11/09/2015 | Page 2 of 4 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 E1SCA18-14.7456M Recommended Solder Reflow Methods High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3°C/Second Maximum 150°C 175°C 200°C 60 - 180 Seconds 3°C/Second Maximum 217°C 60 - 150 Seconds 260°C Maximum for 10 Seconds Maximum 250°C +0/-5°C 20 - 40 Seconds 6°C/Second Maximum 8 Minutes Maximum Level 1 Temperatures shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 11/09/2015 | Page 3 of 4 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 E1SCA18-14.7456M Recommended Solder Reflow Methods Low Temperature Infrared/Convection 245°C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5°C/Second Maximum N/A 150°C N/A 30 - 60 Seconds 5°C/Second Maximum 150°C 200 Seconds Maximum 245°C Maximum 245°C Maximum 2 Times / 230°C Maximum 1 Time 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time 5°C/Second Maximum N/A Level 1 Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 11/09/2015 | Page 4 of 4 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
E1SCA18-14.7456M TR 价格&库存

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E1SCA18-14.7456M TR
  •  国内价格 香港价格
  • 1+2.558271+0.33139
  • 10+2.2384810+0.28997
  • 25+2.1156925+0.27406
  • 50+2.0291350+0.26285
  • 100+1.94546100+0.25201
  • 250+1.83948250+0.23828
  • 500+1.76333500+0.22842

库存:973

E1SCA18-14.7456M TR
  •  国内价格 香港价格
  • 1000+1.690361000+0.21896
  • 2000+1.620452000+0.20991
  • 3000+1.580903000+0.20479
  • 5000+1.532435000+0.19851
  • 7000+1.501327000+0.19448
  • 10000+1.4690410000+0.19030
  • 25000+1.3893125000+0.17997
  • 50000+1.3319350000+0.17254

库存:973